HAD810全自动平面固晶机

HAD810（全自动平面固晶机）

（周期： 220ms）

适用于IC类框架

一、机型特性

1.直线电机驱动的双点胶系统；

2.高精度直线驱动固晶绑头,音圈扭力环精确控制固晶压力；

3.高精度搜寻芯片平台，伺服电机驱动芯片角度矫正系统，配备自动扩膜系统；

4.采用点胶独立控制系统，胶量控制更加精确；

5.采用真空漏晶检测；

6.工控机控制设备运行，简化了自动化设备的操作；

7.精准的自动化设备为企业提高生产效率，降低成本提供了有效保障，从而切实有效地提高了企业竞争力；

HAD810

Automatic Plane-type Die Bonder

Cycle: 220ms

It is compatible with IC frame

1.        Linear motor is applied to drive double adhesive dispensing bond head;

2.        High precision linear driving die bond tieback, voice coil torsion loop controls die bond pressure accurately;

3.        High-precision die platform searching, servo motor driving die angle correction system, equipped with automatic film expansion system;

4.        A separate dispensing control system is adopted to make a precisely control of dispensing amount;

5.        Vacuum die missing testing technology is adopted;

6.        IPC will control the operation of equipment, simplifying the operation of automation equipment;

7.        Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance your enterprise’s competitiveness.